The RF800 solution is an efficient soldering agent, specially created for working with SMD components and precision electronic repairs. Its formula ensures good adhesion
on copper or tin surfaces, facilitating the formation of stable and clean connections. Being a No Clean type solution, it is no longer necessary
to clean the board after use, which simplifies your work and reduces repair time. It is a practical choice
for assembling new components and maintaining electronic equipment,
offering consistent results and a smoother soldering process.
Features:
- Flux type: No-clean
- Quantity: 100ml
- Optimized for copper (Cu) and lead-tin (PbSn) surfaces
- Efficiency: No cleaning required after application, saving time in the maintenance process