Presentation
| Product type | BGA Screen |
Sale package
| Pack | Bulk |
| Content | BGA Screen |
| Product status | New |
Amaoe BGA Mesh for eMMC DDR Memory
Amaoe BGA Mesh for eMMC DDR Memory is a professional tool designed for rebaling operations and solder point restoration on memory chips.
It is intended for advanced service work and offers extended compatibility with several types of packages commonly used in electronic repairs.
The mesh is designed for use with EMMC3 BGA and is compatible with variants such as BGA162, BGA153, BGA169, BGA221, BGA186, BGA254,
as well as with EMCP chips and eMMC Memory Flash ICs. Due to its precise construction, it allows correct solder placement
and contributes to achieving uniform results in the rebaling process. Made from durable metal mesh, the mesh is designed to withstand high temperatures
during soldering, maintaining its shape and accuracy in use. This helps achieve stable and correct interventions, essential in work on memories
and BGA components. Its design allows efficient and controlled use, suitable for both professional technicians
and users performing fine work in the field of electronic repairs.
Features:
- Compatibility: EMMC3 BGA, BGA162, BGA153, BGA169, BGA221, BGA186, BGA254, EMCP, eMMC Memory Flash IC
- Usage: rebaling and solder placement for memory chips
- Material: metal mesh resistant to high temperatures
- Advantages: good precision, thermal resistance, professional use